2 Layer Flexible PCB Production Record #FPC-20260321-050

For this order of 500 flexible PCBs, production centered on 2-layer designs using 1/2 oz rolled copper on a 0.13 mm thick polyimide substrate. The boards feature compact dimensions of 6.35 x 51.8 mm, conventional 6/6 mil line width and spacing, and 0.3 mm minimum holes. We applied yellow solder mask with white silkscreen and completed the surface with immersion gold ENIG to ensure reliable connectivity and protection.

Given the absence of stiffeners on these thin and narrow circuits, we focused on precise polyimide material handling and coverlay lamination to sustain the required flexibility. The manufacturing sequence incorporated accurate circuit imaging and etching, solder mask application, electroless nickel and immersion gold deposition steps. Dynamic flex testing, along with batch AOI inspection and electrical testing, verified that all 500 boards met performance criteria without deviation.

The entire production was executed over 10 days, resulting in uniform output tailored to the distinctive requirements of this flexible PCB configuration. This approach ensures the delivered boards provide consistent reliability in their intended compact, bendable applications.