Single Layer Flexible PCB Production Record #FPC-20260402-067

This manufacturing record covers a batch of 400 single-layer Flexible boards, each measuring 65 by 70 mm with a total thickness of 0.13 mm. Using rolled copper on polyimide base and incorporating PI stiffeners, these boards were built to include yellow soldermask, white legend, and immersion gold ENIG surface treatment. The thin material demanded specialized handling during preparation and lamination to maintain integrity and flatness.

Circuit patterns at 6/6 mil were formed through imaging and etching, followed by coverlay lamination and solder mask application. We executed electroless nickel deposition and immersion gold deposition to meet the ENIG requirements. Dynamic flex testing was performed to verify the circuits' durability under bending stress.

Subsequent batch AOI inspection, yield control management, and electrical testing ensured all units performed to specification. The entire process wrapped up smoothly in three days, resulting in a consistent and reliable delivery of these custom flex circuits.