2 Layer Flexible PCB Production Record #FPC-20260413-043

Manufacturing of these 1000 units of 2-layer flexible circuits focused on an ultra-thin 0.1 mm construction using 1/3 oz rolled copper on narrow 292.5 × 8.5 mm boards. PI stiffeners were selectively applied for reinforcement while yellow soldermask, white silkscreen, and immersion gold ENIG surface finish met the surface requirements. With 6/6 mil track spacing and 0.3 mm minimum holes, the geometry remained within standard flexible circuit parameters yet demanded precise handling due to the elongated aspect ratio and minimal thickness.

Polyimide material handling was prioritized during circuit imaging, etching, and FPC coverlay lamination to avoid distortion on the slender panels. Dynamic flex testing verified endurance under repeated bending cycles, while electroless nickel and immersion gold deposition delivered uniform plating coverage suited to the thin substrate. These steps addressed the specific mechanical demands of the long-strip design.

Electrical testing and batch inspection confirmed consistent electrical and mechanical performance across the lot. The order completed in 8.1 days, yielding reliable flexible circuits that matched all specified parameters for the intended application.