2 Layer Flexible PCB Production Record #FPC-20260528-034

This order comprised 200 panelized 2-layer flex PCBs built on 0.2 mm polyimide with 1 oz rolled copper. Measuring 94 × 127 mm, the boards specified 6/6 mil trace and spacing, 0.3 mm minimum holes, yellow soldermask, white silkscreen, and PI stiffeners laminated in reinforcement zones. ENIG surface finish was applied to deliver a flat, solderable surface on the thin flex material while preserving the inherent bend characteristics of rolled copper construction.

Production followed a disciplined sequence of polyimide material handling, circuit imaging and etching, coverlay lamination, and solder mask application. Electroless nickel and immersion gold deposition steps were tightly controlled to achieve uniform ENIG coverage. Dynamic flex testing subjected sample circuits to repeated bending cycles, confirming mechanical endurance before full electrical testing verified continuity and isolation on every panel.

The complete run was delivered in 6.8 days with stable process parameters that maintained registration accuracy and layer adhesion throughout. These execution details support consistent long-term reliability for applications requiring yellow soldermask flexible PCBs with integrated PI stiffeners.