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2 Layer Flexible PCB Production Record #FPC-20260528-035

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PCB Specifications

Parameter Value Parameter Value
PCB Type Flexible PCB Quantity 300 pcs
Layers 2 Layers Board Type Panel PCB
Dimensions 23 x 97 mm Copper Weight 1OZ
Thickness 0.2 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Yellow Silkscreen White
Material Rolled Copper Stiffener PI Stiffener

Manufacturing Timeline

Order Created
May 21 10:09
Files Ready
May 21 10:25
Engineering Review Completed
May 21 10:53
Payment down
May 21 22:20
Production Started
May 21 22:22
Production Completed
May 31 13:46
Progress: 0/6
Engineering Review time: 9 min
Production time: 9.7d With Engineering Questions

Logistics Information

Production Completed→Shipping : 1.1d
Carrier
DHL
Destination
KOREA, REPUBLIC OF (SOUTH K.)
Shipping Method
Express Air
Shipping Time
Jun 01 15:33

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Polyimide Material Handling
04
Circuit Imaging & Etching
05
Coverlay Lamination
06
Solder Mask Application
07
Electroless Nickel Deposition
08
Immersion Gold Deposition
09
Dynamic Flex Testing
10
Panelization Optimization
11
Batch AOI Inspection
12
Yield Control Management
13
Electrical Testing

Manufacturing Summary

This production record covered 300 panels of 2-layer flex PCBs built on 0.2 mm rolled copper polyimide. Measuring 23 x 97 mm, each board received PI stiffeners for localized rigidity while carrying a yellow soldermask, white silkscreen, and immersion gold ENIG finish. The thin construction and material choice required exact control during lamination and plating to preserve flex characteristics and surface integrity.

 

Polyimide material handling formed the initial focus, followed by circuit imaging and etching at standard 6/6 mil geometry. Coverlay lamination preceded solder mask application, after which electroless nickel deposition and immersion gold plating created the final ENIG surface. Process parameters stayed aligned with the 0.3 mm minimum hole size and overall panel layout throughout.

 

Dynamic flex testing assessed endurance under repeated bending, with AOI inspection and electrical testing confirming performance across the full quantity. All boards met specifications without deviation, completing the manufacturing cycle in 5.7 days.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FPC-20260821-065 Flexible PCB 4 111.25 x 16.75 Yellow ENIG (Immersion Gold) 5 View detail
FPC-20260819-026 Flexible PCB 4 59.8 x 65.5 Yellow ENIG (Immersion Gold) 25 View detail
FPC-20260810-032 Flexible PCB 4 357 x 45.8 Black ENIG (Immersion Gold) 1000 View detail

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