PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | Flexible PCB | Quantity | 500 pcs |
| Layers | 2 Layers | Board Type | Single PCB |
| Dimensions | 38 x 12.5 mm | Copper Weight | 2OZ |
| Thickness | 0.32 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.3mm↑ |
| Solder Mask | Yellow | Silkscreen | White |
| Material | Rolled Copper | Stiffener | None |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
This order comprised 500 units of 2-layer flex boards built on rolled copper with 2 oz weight, measuring 38 × 12.5 mm and only 0.32 mm thick. The thin construction required precise handling of polyimide material to retain flexibility while accommodating the heavier copper. Yellow solder mask was applied over coverlay lamination, paired with white silkscreen and immersion gold ENIG finish, delivering both visual distinction and stable surface properties without stiffeners.
Circuit imaging, thick copper electroplating, and controlled etching were sequenced to maintain accurate 6/6 mil geometry across the thin substrate. Dynamic flex testing verified mechanical endurance under repeated bending, while batch AOI and electrical testing confirmed continuity and insulation on every board. These steps addressed the combined challenges of heavy copper and minimal thickness.
The run completed in 8.4 days with stable process parameters, producing consistent flexible circuits that met all dimensional, electrical, and reliability requirements.
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Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FPC-20260821-065 | Flexible PCB | 4 | 111.25 x 16.75 | Yellow | ENIG (Immersion Gold) | 5 | View detail |
| FPC-20260819-026 | Flexible PCB | 4 | 59.8 x 65.5 | Yellow | ENIG (Immersion Gold) | 25 | View detail |
| FPC-20260810-032 | Flexible PCB | 4 | 357 x 45.8 | Black | ENIG (Immersion Gold) | 1000 | View detail |
