4 Layer FR4 PCB Production Record #FR4-20260403-059
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 75 pcs |
| Layers | 4 Layers | Board Type | Panel PCB |
| Dimensions | 108.6 x 275.6 mm | Copper Weight | 1oz |
| Thickness | 1.6 mm | Min Track / Spacing | 5/5mil |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.2mm |
| Solder Mask | Red | Silkscreen | White |
| Stack-up | Default | Impedance Control | No |
This 4-layer FR-4 board (108.6 × 275.6 mm, 1.6 mm thick, TG170, 1 oz copper on both sides) was produced in a 1×5 panel format for a total of 375 pieces. With a minimum line/space of 5 mil and 0.2 mm holes, the design stayed within standard geometry while incorporating immersion gold surface finish and beveled gold fingers. The red solder mask and white silkscreen were applied with precise registration, and the panel utilized 2.54 mm process edges with controlled routing slots.
During DFM review, several clarifications were required for reliable execution. Non-plated slots specified at 0.5 mm finished size were confirmed for 0.55 mm control to account for material behavior without copper plating. Outer-layer traces extending beyond the board outline were trimmed post-routing to prevent exposed copper at cut edges. Gold finger areas required confirmation of beveling and corresponding solder mask window openings per provided reference images, along with adjusted process edge spacing to maintain panel integrity. All adjustments were implemented prior to production release, ensuring dimensional stability and functional compliance.
Production completed within the 4-day delivery window with 100% flying probe testing. The combination of TG170 material, immersion gold, and precise gold finger bevel and mask window control delivered consistent plating adhesion and edge quality across the full batch. Final boards met all electrical and mechanical specifications with no yield loss from the addressed engineering points.
Standard multilayer solution offering practical routing density and controlled impedance for industrial and consumer electronics.
Real multilayer FR4 PCB CAM review cases covering stack-up confirmation, impedance control, copper balance, via tenting, and edge clearance EQs. Discover practical DFM best practices for 4-layer and higher boards to reduce engineering queries, prevent warpage, and improve first-pass yield.
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260630-014 | FR4 PCB | 2 | 126 x 145 | Green | ENIG (Immersion Gold) | 10 | View detail |
| FR4-20260605-042 | FR4 PCB | 4 | 65 x 100 | Green | HASL Lead Free | 5 | View detail |
| FR4-20260605-041 | FR4 PCB | 4 | 66.04 x 54.1 | Green | HASL Lead Free | 5 | View detail |
