8 Layer FR4 PCB Production Record #FR4-20260811-033

These 8-layer panel PCBs were produced in a quantity of 50, each measuring 226.8 x 109 mm with 1 mm thickness and a custom stackup. The 4/4 mil minimum track and spacing on 1 oz copper, combined with 0.2 mm holes, necessitated precise circuit imaging and etching processes. Layer stack alignment received close attention prior to high pressure lamination to ensure reliable multilayer construction.

Green soldermask with white silkscreen was applied before the electroless nickel and immersion gold steps that created the ENIG surface finish. Full electrical testing confirmed the integrity of each panel following completion of the surface treatments. The panel format allowed efficient processing without requiring specialized impedance controls or blind vias.

Production was completed over 11.3 days from initial engineering review through material preparation and final testing. The batch exhibited good consistency, reflecting accurate execution of the specified parameters for these multilayer boards with tighter geometries.