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4 Layer FR4 PCB Production Record #FR4-20260421-036

FR4 PCB 4 Layers HASL Lead Free Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 5 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 65.02 x 321.82 mm Copper Weight 1oz
Thickness 0.8 mm Min Track / Spacing 10/10mil
Surface Finish HASL Lead Free Min Hole Size 0.3mm↑
Solder Mask White Silkscreen Yellow
Stack-up Default Impedance Control No

Manufacturing Timeline

Order Created
Mar 19 11:27
Files Ready
Mar 19 11:33
Engineering Review Completed
Mar 21 20:55
Payment down
Mar 21 00:23
Production Started
Mar 21 20:55
Production Completed
Mar 29 02:32
Progress: 0/6
Engineering Review time: 2.4d Multiple File Revisions
Production time: 7.3d With Engineering Questions

Logistics Information

Production Completed→Shipping : 23.6d
Carrier
FedEx IP
Destination
UNITED STATES OF AMERICA
Shipping Method
Express Air
Shipping Time
Apr 21 16:01

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Solder Mask Application
08
Molten Solder Coating
09
Hot Air Leveling
10
Electrical Testing

Manufacturing Summary

This 4-layer FR-4 board measured 65.02 × 321.82 mm with 1 oz copper on inner and outer layers and a thin finished thickness of 0.8 mm. Produced in a small run of 5 pieces using KB-6165F TG150 material, the design used a standard 10 mil line/space, lead-free HASL surface finish, and included slotted features with 4 mm process edges on top and bottom sides. No impedance control, blind vias, or resin plugging was required, with single-panel mechanical forming and 100% flying probe testing.

 

DFM review addressed multiple file clarifications including text orientation on L3 and L4 layers, bottom silkscreen SN marking, and confirmation of the authoritative set of documents. The primary engineering concern involved customer-specified countersink hole parameters calling for approximately 0.85 mm depth on a 0.8 mm board, which risked breakthrough and damage to L1/L2 copper layers. Parameters were reconciled and adjusted to safe limits before release, following established countersink depth control on thin boards to protect inner layer integrity while meeting functional requirements. Cycle marking updates were also implemented per the revised order instructions.

 

Production completed without deviation, delivering boards that met all dimensional, copper, and electrical specifications. The thin panel configuration maintained flatness and registration throughout processing, supporting reliable performance for this low-volume order.

 

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260628-010 FR4 PCB 2 60 x 120 Green HASL Lead Free 5 View detail
FR4-20260619-010 FR4 PCB 2 121 x 121 Green HASL Lead Free 50 View detail
FR4-20260618-018 FR4 PCB 2 54.74 x 106.93 Green HASL Lead Free 5 View detail

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