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4 Layer FR4 PCB Production Record #FR4-20260423-037

FR4 PCB 4 Layers HASL Lead Free Mass Production
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 250 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 244 x 298 mm Copper Weight 1oz
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish HASL Lead Free Min Hole Size 0.3mm↑
Solder Mask White Silkscreen Black
Stack-up Custom Impedance Control No
Blind/Buried Vias No

Manufacturing Timeline

Order Created
Mar 26 00:28
Files Ready
Mar 26 00:28
Engineering Review Completed
Mar 31 18:33
Payment down
Apr 10 15:56
Production Started
Apr 10 15:56
Production Completed
Apr 22 15:40
Progress: 0/6
Engineering Review time: 5.7d
Production time: 12.0d With Engineering Questions

Logistics Information

Production Completed→Shipping : 0.8d
Carrier
FedEx IP
Destination
BRAZIL
Shipping Method
Express Air
Shipping Time
Apr 23 09:53

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Solder Mask Application
08
Molten Solder Coating
09
Hot Air Leveling
10
Panelization Optimization
11
Batch AOI Inspection
12
Yield Control Management
13
Electrical Testing

Manufacturing Summary

This 4-layer FR-4 board measured 244 × 298 mm at 1.6 mm thickness with 1 oz copper layers and TG150 material. The 3000-piece order (250 sets) used lead-free HASL finish, white solder mask, black silkscreen, and 6 mil line/space. Panelization followed customer layout at 3×4 with V-scoring for separation. Production confirmation was obtained after stackup and DFM adjustments, completing within 10 days.

 

The customer-specified lamination structure was reviewed against standard capability, leading to a proposed adjustment that maintained required performance. Slot hole tolerances were confirmed with PTH ±0.076 mm to accommodate process variation. Some silkscreen characters fell below minimum height with no room for enlargement, resulting in acceptance of potential minor blurring. Additional production numbering and date codes were added to the top layer per customer request, while other parameters followed system order data.

 

All clarifications and file updates were implemented before release to pressing and etching. 100% flying probe testing confirmed electrical integrity on delivery. For details on the lamination structure optimization, refer to the engineering case study.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260628-010 FR4 PCB 2 60 x 120 Green HASL Lead Free 5 View detail
FR4-20260619-010 FR4 PCB 2 121 x 121 Green HASL Lead Free 50 View detail
FR4-20260618-018 FR4 PCB 2 54.74 x 106.93 Green HASL Lead Free 5 View detail

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