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ENIG FR4 PCB Production Record #FR4-20260430-040

FR4 PCB 12 Layers ENIG (Immersion Gold) Impedance Control 0.2mm vias Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 20 pcs
Layers 12 Layers Board Type Single PCB
Dimensions 138.43 x 147.57 mm Copper Weight 0.5oz
Thickness 1.6 mm Min Track / Spacing 5/5mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.2mm
Solder Mask Green Silkscreen White
Stack-up Custom Impedance Control Yes

Manufacturing Timeline

Order Created
Jan 01 00:00
Files Ready
Mar 30 10:43
Engineering Review Completed
Apr 22 16:04
Payment down
Jan 01 00:00
Production Started
Apr 22 16:04
Production Completed
Apr 30 15:08
Progress: 0/6
Engineering Review time: 23.3d
Production time: 8.0d With Engineering Questions

Logistics Information

Production Completed→Shipping : 9 min
Carrier
DHL
Destination
PHILIPPINES, THE
Shipping Method
Express Air
Shipping Time
Apr 30 15:17

Key Manufacturing Processes

01
Engineering Review
02
Stackup Impedance Engineering
03
Trace Width Compensation
04
Material Preparation
05
Inner Layer Imaging
06
Circuit Imaging & Etching
07
Layer Stack Alignment
08
High Pressure Lamination
09
Solder Mask Application
10
Electroless Nickel Deposition
11
Immersion Gold Deposition
12
TDR Impedance Testing
13
Electrical Testing

Manufacturing Summary

This multilayer FR-4 board featured impedance control requirements with varying copper thicknesses noted in the stackup. Production proceeded with the supplied gerber files, ignoring supplementary tgz and PDF documents after confirmation. The order included customer-requested production serial numbering on the top layer silkscreen and adjustments for via mask openings on the bottom layer to align with actual data.

 

DFM review highlighted inconsistencies between the order specifications and provided files, particularly regarding via treatments and stackup details. Proposed production stackup was shared to accommodate real manufacturing capability, requiring trace width adjustments on impedance lines to meet target values while maintaining signal integrity. Copper thickness variations across layers were reconciled through calculation and customer approval before proceeding to lamination.

 

All file confirmations and modifications were completed prior to release, ensuring smooth execution through etching, plating, and testing phases. The boards were delivered with verified impedance performance. Details on the impedance line width compensation are covered in the engineering case study.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260630-014 FR4 PCB 2 126 x 145 Green ENIG (Immersion Gold) 10 View detail
FR4-20260529-059 FR4 PCB 2 147.3 x 53.8 Green ENIG (Immersion Gold) 5 View detail
FR4-20260520-046 FR4 PCB 2 94.21 x 275 Green ENIG (Immersion Gold) 75 View detail

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