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2 Layer FR4 PCB Production Record #FR4-20260510-065

FR4 PCB 2 Layers OSP Small Volume
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 100 pcs
Layers 2 Layers Board Type Panel PCB
Dimensions 226 x 186 mm Copper Weight 1oz
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish OSP Min Hole Size 0.3mm↑
Solder Mask White Silkscreen None
Stack-up Custom Impedance Control No

Manufacturing Timeline

Order Created
May 01 01:16
Files Ready
May 01 01:16
Engineering Review Completed
May 01 02:10
Payment down
May 01 04:32
Production Started
May 01 04:33
Production Completed
May 10 19:18
Progress: 0/6
Engineering Review time: 7 min
Production time: 9.7d With Engineering Questions

Logistics Information

Production Completed→Shipping : 6 min
Carrier
FedEx IP
Destination
BRAZIL
Shipping Method
Express Air
Shipping Time
May 10 19:23

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Circuit Imaging & Etching
04
Solder Mask Application
05
Organic Coating Application
06
Anti-Oxidation Treatment
07
Electrical Testing

Manufacturing Summary

This 2-layer FR-4 board measured 226 × 186 mm with 1.6 mm thickness, TG150 material, and 1 oz copper on both sides. Produced as 1200 pieces in 6×2 panels for 100 sets, the order used OSP surface finish, cold white solder mask, and no silkscreen. Line/space remained at standard 6 mil with 0.3 mm minimum holes, and the 3-day schedule included 100% flying probe testing together with routing separation.

 

DFM review addressed several process points. Multiple holes larger than 3 mm required confirmation of whether precision routing was needed to maintain positional accuracy and edge quality. Connection tabs in the panel data lacked mouse bites, which could lead to difficult or incomplete depanelization; standard stamp holes were reviewed for addition. Dimensional tolerances were aligned to factory conventional values, with any conflicting notes disregarded after confirmation.

 

Confirmed adjustments to hole processing and panel tabs were implemented prior to production. The high-volume run achieved consistent OSP surface finish consistency across the panels within the accelerated timeline. Full electrical test reports and quality certificates accompanied the shipment, confirming the boards met the specified mechanical and electrical requirements.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260708-079 FR4 PCB 2 323.77 x 379.03 White HASL Lead Free 400 View detail
FR4-20260708-015 FR4 PCB 2 15 x 41.7 White HASL Lead Free 5 View detail
FR4-20260630-014 FR4 PCB 2 126 x 145 Green ENIG (Immersion Gold) 10 View detail

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