2 Layer FR4 PCB Production Record #FR4-20260513-014

For this order of 25 single 2-layer FR4 PCBs, production followed a custom stackup using 1.6 mm thickness and 1 oz copper on both sides. Boards measured 138.7 × 65.9 mm with standard 6/6 mil track and spacing together with 0.8 mm minimum holes. The absence of solder mask and impedance control allowed conventional process parameters during imaging and etching while directing attention to surface preparation for the white silkscreen applied directly to the laminate.

HASL Lead Free surface finish was achieved through molten solder coating and hot air leveling, tinning all exposed copper traces and pads without mask protection. This required sequenced handling after etching to maintain cleanliness and prevent oxidation before silkscreen application. The chosen finish and bare-board configuration suit applications needing direct soldering or probe access, and all parameters stayed within proven process windows.

Engineering review, material preparation, circuit imaging, etching, and electrical testing were completed in 1.6 days. Every board passed continuity and isolation checks, confirming reliable electrical performance and consistent feature accuracy across the full set.

This order also received positive feedback from the customer regarding the consistent quality and reliable delivery. View the full customer review→