2 Layer FR4 PCB Production Record #FR4-20260916-026

For the batch of five 2-layer FR4 panel PCBs measuring 187 × 284 mm with 0.8 mm thickness and 1 oz copper, material preparation emphasized stable handling of the thinner laminate to maintain flatness and registration. The 6/6 mil trace spacing and 0.3 mm minimum holes fit standard process windows, allowing circuit imaging and etching to proceed at conventional exposure and etch rates while producing sharp features across the custom stackup.

Green solder mask and white silkscreen were applied before the lead-free HASL surface finish. Molten solder coating and hot air leveling delivered an even, protective layer that supports reliable through-hole and SMT soldering. These steps were sequenced to minimize thermal stress on the thinner panels and preserve solder mask adhesion.

Final electrical testing verified continuity and isolation on all five panels with no defects recorded. The complete manufacturing sequence concluded in 2.4 days, resulting in consistent board quality, precise hole plating, and flatness that matched the specified requirements for this standard-geometry yet thin-profile order.

This order also received positive feedback from the customer regarding the consistent quality and reliable delivery. View the full customer review→