4 Layer FR4 PCB Production Record #FR4-20261009-082

This standard 4-layer FR4 PCB order consisted of five panels, each measuring 132.5 x 88.9 mm and built to 1.6 mm thickness with 1 oz copper layers. With a conventional 6 mil minimum trace and spacing and 0.3 mm hole size, the design presented no extraordinary fabrication challenges. We performed inner layer imaging, etching, and precise layer stack alignment prior to high-pressure lamination.

Following lamination, we applied matte green solder mask and white silkscreen for component identification. The leaded HASL surface finish was then deposited using molten solder coating and hot air leveling to create a uniform protective layer. These steps ensure excellent shelf life and solderability for the delivered panels.

Final electrical testing validated the integrity of each net on all five panels. The complete manufacturing process, from initial review to tested output, required 8.3 days and resulted in panels meeting all specified requirements for reliable performance.

This order also received positive feedback from the customer regarding the consistent quality and reliable delivery. View the full customer review→