6 Layer Rigid-Flex PCB Production Record #RFP-20240703-0081

This batch consisted of 25 panelized 6-layer rigid-flex PCBs with overall dimensions of 102.9 mm by 89.6 mm and a controlled thickness of 0.8 mm. Using 1 oz copper throughout, the boards featured standard 6/6 mil minimum track and spacing along with 0.25 mm holes. Our manufacturing sequence incorporated detailed engineering review, precise inner layer imaging and etching, followed by careful layer stack alignment and high-pressure lamination. The flex-rigid lamination process received specific focus to achieve reliable bonding between the rigid FR4 sections and flexible polyimide layers. Controlled depth routing was then performed to accurately profile the panels.

Subsequent steps included solder mask application in matte black, white silkscreen legend, and immersion gold ENIG plating for the surface finish. We conducted dynamic flex reliability testing to validate the bending endurance of the flexible portions, in addition to standard electrical testing of all circuits. These measures ensured the rigid-flex PCBs would perform reliably in their intended environment.

All 25 panels passed inspection with consistent results, confirming the effectiveness of the chosen processes for this specification. The entire production was completed over 25.9 days, aligning with the scheduled delivery.