Coupons
Help
  • FAQ
    browse most common questions
  • Live Chat
    talk with our online service
  • Email
    contact your dedicated sales:

6 Layer Rigid-Flex PCB Production Record #RFP-20260518-038

Start Rigid-Flex PCB Quote

PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 5 pcs
Layers 6 Layers Board Type Single PCB
Dimensions 106.5 x 24 mm Copper Weight 1OZ
Thickness 1.6 mm Min Track / Spacing 4/4mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen White

Manufacturing Timeline

Order Created
Apr 16 10:12
Files Ready
Apr 16 10:20
Engineering Review Completed
Apr 16 11:49
Payment down
May 08 03:14
Production Started
May 08 03:18
Production Completed
May 18 10:12
Progress: 0/6
Engineering Review time: 0.7 h
Production time: 10.3d With Engineering Questions

Logistics Information

Production Completed→Shipping : 8 min
Carrier
DHL
Destination
UNITED STATES OF AMERICA
Shipping Method
Express Air
Shipping Time
May 18 10:20

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Flex-Rigid Lamination
08
Solder Mask Application
09
Electroless Nickel Deposition
10
Immersion Gold Deposition
11
Controlled Depth Routing
12
Dynamic Flex Reliability Testing
13
Electrical Testing

Manufacturing Summary

Production of this 6-layer rigid-flex PCB centered on five units with dimensions of 106.5 x 24 mm and 1.6 mm thickness. The stack used 1 oz copper throughout with a tighter 4/4 mil trace and spacing requirement, green soldermask, white silkscreen, and immersion gold ENIG finish. These parameters, combined with the rigid-flex transitions on a narrow board, dictated careful PCB material selection and registration control from the start.

 

Layer stack alignment, flex-rigid lamination, and high-pressure consolidation were performed to ensure stable bonding at the material interfaces. Controlled depth routing defined the flexible zones accurately, after which dynamic flex reliability testing subjected each board to repeated bend cycles. Subsequent electrical testing verified net continuity and impedance stability across all five panels.

 

The 10.3-day manufacturing run delivered consistent results tailored to the low-volume order and its mechanical demands. Every process step from inner layer imaging through final electroless nickel and immersion gold deposition was executed to match the specified tolerances for long-term reliability in rigid-flex applications.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260708-046 Rigid-Flex PCB 6 205 x 20 Green ENIG (Immersion Gold) 125 View detail
RFP-20260127-036 Rigid-Flex PCB 6 149.1 x 209.3 Green ENIG (Immersion Gold) 25 View detail
RFP-20251208-0053 Rigid-Flex PCB 6 55 x 25.5 Matte Black ENIG (Immersion Gold) 80 View detail

2026 AIVON.COM All Rights Reserved
Intellectual Property Rights | Terms of Service | Privacy Policy | Refund Policy