6 Layer Rigid-Flex PCB Production Record #RFP-20260421-0020

This order comprised five panels of 6-layer rigid-flexible board, each measuring 196 × 94.9 mm with 1.0 mm finished thickness and 1 oz copper throughout. The design employed standard 6/6 mil trace and spacing together with 0.3 mm minimum holes, green soldermask, and immersion gold ENIG surface finish. No silkscreen was required. These parameters called for careful material selection to balance rigid FR-4 sections with flexible polyimide layers while maintaining registration across the rigid-flex transition zones.

Execution included layer stack alignment, high-pressure lamination, and flex-rigid lamination to ensure void-free bonding. Controlled depth routing produced precise outlines without compromising internal flex circuits. Dynamic flex reliability testing subjected sample circuits to repeated bend cycles, confirming mechanical integrity before final release. Electroless nickel deposition and immersion gold deposition were tightly sequenced to achieve uniform ENIG coverage on both rigid and flex areas.

Electrical testing verified netlist compliance on all five panels. The completed rigid-flex PCBs exhibited stable interlayer alignment and consistent flex endurance, delivering the reliability expected for this low-volume production run completed on 2025-12-09.