PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | Rigid-Flex PCB | Quantity | 125 pcs |
| Layers | 6 Layers | Board Type | Panel PCB |
| Dimensions | 205 x 20 mm | Copper Weight | 1OZ |
| Thickness | 1.6 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.3mm↑ |
| Solder Mask | Green | Silkscreen | White |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
This production record covers 125 panels of 6-layer rigid-flex PCB, each with dimensions of 205 x 20 mm and a finished thickness of 1.6 mm using 1 oz copper. The specification called for standard 6/6 mil geometry and 0.3 mm minimum holes, completed with immersion gold ENIG surface finish, green soldermask, and white silkscreen. These parameters required particular attention during the flex-rigid transition zones to maintain signal integrity and mechanical stability.
Key processes included precise layer stack alignment, high-pressure lamination, and dedicated flex-rigid lamination steps. We applied controlled depth routing to separate the panel configurations accurately. Dynamic flex reliability testing was performed to confirm the durability of the flexible sections under repeated motion, supplemented by thorough electrical testing to verify all interconnections.
The 12.7-day production cycle yielded panels that met all specified requirements, demonstrating reliable execution for this rigid-flex design.
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Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| RFP-20260518-038 | Rigid-Flex PCB | 6 | 106.5 x 24 | Green | ENIG (Immersion Gold) | 5 | View detail |
| RFP-20260127-036 | Rigid-Flex PCB | 6 | 149.1 x 209.3 | Green | ENIG (Immersion Gold) | 25 | View detail |
| RFP-20251208-0053 | Rigid-Flex PCB | 6 | 55 x 25.5 | Matte Black | ENIG (Immersion Gold) | 80 | View detail |
