6 Layer Rigid-Flex PCB Production Record #RFP-20260807-039

These 30 six-layer rigid-flex PCBs were manufactured in panel format, each measuring 196 × 90 mm with 1.2 mm finished thickness, 1 oz copper, and standard 6/6 mil trace spacing. The stack-up combined rigid FR-4 sections with flexible polyimide layers, protected by green soldermask, white silkscreen, and immersion gold ENIG surface finish. Minimum hole size of 0.3 mm supported reliable plating while the overall configuration demanded precise control during material preparation and layer transitions.

We executed high-pressure lamination and flex-rigid lamination after inner layer imaging and etching to maintain registration across dissimilar materials. Controlled depth routing accurately defined the bend areas, followed by solder mask application and sequential electroless nickel and immersion gold deposition. Dynamic flex reliability testing was performed to confirm the panels could sustain repeated bending without trace fracture or delamination.

Full electrical testing on all panels verified netlist compliance and impedance stability. The completed rigid-flex circuits exhibited consistent layer-to-layer alignment and mechanical endurance, meeting the order's requirements for dependable performance in compact, movable assemblies.