6 Layer Rigid-Flex PCB Production Record #RFP-20250421-0077

This production record covers five units of 6-layer rigid-flexible PCB, each measuring 216 × 101.5 mm with a finished thickness of 1.2 mm. The build used 1 oz copper, blind vias, and a standard 6/6 mil trace and spacing. A green soldermask, white silkscreen, and immersion gold ENIG surface finish were applied to support reliable component assembly and long-term contact integrity in the hybrid construction.

Manufacturing followed a sequenced approach that included precise layer stack alignment, high-pressure lamination, and dedicated flex-rigid lamination to bond the flexible polyimide zones with the rigid FR4 sections. Controlled depth routing accurately defined the transition areas, while dynamic flex reliability testing verified bending endurance. Complete electrical testing after immersion gold deposition confirmed continuity and isolation across all circuits.

The 26.9-day schedule allowed adequate dwell and stabilization time between each critical step, from inner layer imaging through final routing. All five boards delivered consistent layer registration and flex-to-rigid adhesion, meeting the specified requirements for this low-volume rigid-flex PCB order.