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6 Layer Rigid-Flex PCB Production Record #RFP-20250530-0052

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PCB Specifications

Parameter Value Parameter Value
PCB Type Rigid-Flex PCB Quantity 20 pcs
Layers 6 Layers Board Type Single PCB
Dimensions 162.9 x 55.75 mm Copper Weight 1OZ
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.1mm
Solder Mask Green Silkscreen White

Manufacturing Timeline

Order Created
May 09 00:00
Files Ready
May 09 00:56
Engineering Review Completed
May 09 11:24
Payment down
May 09 11:24
Production Started
May 09 11:24
Production Completed
May 25 14:14
Progress: 0/6
Engineering Review time: 0.4 d
Production time: 16.2d

Logistics Information

Production Completed→Shipping : 0.8 d
Carrier
FedEx IP
Destination
ISRAEL
Shipping Method
Express Air
Shipping Time
May 26 11:56

Key Manufacturing Processes

01
Engineering Review
02
Stackup Impedance Engineering
03
Trace Width Compensation
04
Material Preparation
05
Inner Layer Imaging
06
Circuit Imaging & Etching
07
Layer Stack Alignment
08
High Pressure Lamination
09
Flex-Rigid Lamination
10
Solder Mask Application
11
Electroless Nickel Deposition
12
Immersion Gold Deposition
13
Controlled Depth Routing
14
TDR Impedance Testing
15
Dynamic Flex Reliability Testing
16
Electrical Testing

Manufacturing Summary

This production record covers 20 six-layer rigid-flex PCBs built to 162.9 × 55.75 mm dimensions and 1.6 mm finished thickness. The stack-up combined rigid FR-4 sections with flexible polyimide layers, incorporating blind vias, 1 oz copper, 0.1 mm minimum holes, and 6/6 mil trace spacing. Green soldermask with white silkscreen and immersion gold (ENIG) surface finish completed the surface requirements while supporting the impedance controlled PCB design.

 

Manufacturing began with stackup impedance engineering and trace width compensation, followed by precise inner layer imaging, circuit etching, and flex-rigid lamination under high pressure. Controlled depth routing preserved the flexible zones. Electroless nickel and immersion gold deposition provided uniform ENIG coverage. We then executed TDR impedance testing and dynamic flex reliability testing to confirm signal integrity and mechanical endurance under repeated bending.

 

All boards passed full electrical testing, delivering consistent performance across the batch. The 16-day schedule accommodated thorough verification at each transition from rigid to flex areas, resulting in reliable rigid-flex circuits ready for integration.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
RFP-20260807-039 Rigid-Flex PCB 6 196 x 90 Green ENIG (Immersion Gold) 30 View detail
RFP-20260708-046 Rigid-Flex PCB 6 205 x 20 Green ENIG (Immersion Gold) 125 View detail
RFP-20260518-038 Rigid-Flex PCB 6 106.5 x 24 Green ENIG (Immersion Gold) 5 View detail

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