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4 Layer Rogers PCB Production Record #ROG-20250827-0094

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PCB Specifications

Parameter Value Parameter Value
PCB Type Rogers PCB Quantity 5 pcs
Layers 4 Layers Board Type Single PCB
Dimensions 43.31 x 17.55 mm Copper Weight 1oz
Thickness 1 mm Min Track / Spacing 5/5mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask None Silkscreen None
Material Type Rogers/RO4003C

Manufacturing Timeline

Order Created
Aug 03 22:23
Files Ready
Aug 03 22:23
Engineering Review Completed
Aug 03 22:39
Payment down
Aug 11 19:57
Production Started
Aug 11 19:57
Production Completed
Aug 27 17:14
Progress: 0/6
Engineering Review time: 0.3 h Multiple File Revisions
Production time: 15.9d

Logistics Information

Production Completed→Shipping : 7 min
Carrier
FedEx IP
Destination
SOUTH AFRICA
Shipping Method
Express Air
Shipping Time
Aug 27 17:20

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Rogers Material Preparation
04
Inner Layer Imaging
05
Circuit Imaging & Etching
06
Layer Stack Alignment
07
High Pressure Lamination
08
Low Loss Material Lamination
09
Solder Mask Application
10
Electroless Nickel Deposition
11
Immersion Gold Deposition
12
Electrical Testing

Manufacturing Summary

This 4-layer Rogers PCB measured 43.31 × 17.55 mm with 1 mm nominal thickness and 1 oz copper. Produced as single boards for a quantity of 5 pieces, the design used 5/5 mil line/space geometry, 0.3 mm minimum holes, and ENIG surface finish with no solder mask or silkscreen. The high-frequency material and compact outline required precise control of edge features and step surfaces.

 

DFM review addressed several edge-related risks. The supplied stackup targeted a finished thickness near 1.1 mm ±10 %, which was confirmed against available core and prepreg combinations. Copper on both inner and outer layers approached the board outline too closely, risking exposed copper after routing. Perimeter holes were also positioned near the edge, creating potential for broken or incomplete holes during mechanical forming. Step areas were clarified so that the top surface received ENIG while the bottom remained substrate-exposed.

 

Clearance adjustments and stackup verification were completed prior to production. The revised edge geometry and step plating ensured mechanical integrity and consistent ENIG coverage on the RO4003C material. The small-batch order was finished with full dimensional verification, delivering boards that met the high-frequency material and tight-outline requirements.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
ROG-20251219-001 Rogers PCB 4 53 x 81 None ENIG (Immersion Gold) 10 View detail
ROG-20230422-0073 Rogers PCB 4 38 x 38 Green Bare Copper 50 View detail
ROG-20220330-0174 Rogers PCB 4 38 x 16 Green HASL Lead Free 5 View detail

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