2 Layer Aluminum PCB Production Record #ALU-20251105-0036

This order comprised ten 2-layer Aluminum boards produced in panel format, each measuring 286 × 310 mm with 1.0 mm finished thickness and a 2.0W thermal conductivity base. Boards used 1 oz copper, 10/10 mil trace and spacing, minimum 1.5 mm hole size, white soldermask, white silkscreen, and HASL Lead Free finish rated for AC2500V withstand. These parameters required precise aluminum substrate handling to maintain thermal performance while meeting the large panel dimensions.

Manufacturing followed a defined sequence of metal base preparation, circuit imaging and etching, then thermal insulation lamination to create stable heat-transfer layers without compromising dielectric integrity. Solder mask application was followed by molten solder coating and hot air leveling, producing an even HASL Lead Free surface across the sizable panels. Heat dissipation control steps were applied during lamination and finishing to preserve the specified 2.0W conductivity.

All ten panels passed final electrical testing, confirming consistent voltage withstand and thermal characteristics. The complete production cycle took 27.4 days, delivering boards that align with the exact aluminum PCB requirements for reliable long-term heat management.