2 Layer Aluminum PCB Production Record #ALU-20260411-037
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | Aluminum PCB | Quantity | 20 pcs |
| Layers | 2 Layers | Board Type | Single PCB |
| Dimensions | 105 x 59.5 mm | Copper Weight | 2oz |
| Thickness | 2 mm | Min Track / Spacing | 10/10mil |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 1.5mm↑ |
| Solder Mask | Black | Silkscreen | None |
| Thermal Conductivity | 3.0W | Voltage Withstand | AC2500V |
This production record covers 20 pieces of 2-layer aluminum PCBs measuring 105 × 59.5 mm with 2 mm total thickness, 2oz copper, and 3.0W thermal conductivity. The design used 10/10 mil track and spacing together with 1.5 mm minimum holes, black soldermask, no silkscreen, and immersion gold ENIG finish. These choices supported the AC2500V voltage withstand requirement while prioritizing heat dissipation in a compact aluminum PCB format.
Manufacturing followed a deliberate sequence of metal base preparation, circuit imaging, thick copper electroplating, and controlled etching to form accurate traces on the aluminum substrate. Thermal insulation lamination bonded the dielectric layer with stable adhesion, after which solder mask application and electroless nickel followed by immersion gold deposition completed the surface. Heat dissipation control steps maintained material flatness and registration throughout these operations.
Electrical testing after the 28.7-day schedule confirmed consistent performance and dielectric integrity across the full batch. The executed process delivered aluminum PCBs that meet the thermal, electrical, and mechanical parameters specified for this order.
These PCBs feature two copper layers on an aluminum substrate with thin dielectric for thermal transfer. They support higher circuit density than single layer designs while maintaining superior heat dissipation.
Explore common engineering queries in 2 layer aluminum PCB manufacturing, including CTE mismatch, thermal via design, dielectric bonding, and solder mask registration issues. Learn practical DFM solutions to reduce warpage, improve thermal performance, and increase production yield.
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| ALU-20260511-016 | Aluminum PCB | 2 | 91 x 70 | Green | ENIG (Immersion Gold) | 10 | View detail |
| ALU-20260411-047 | Aluminum PCB | 2 | 102 x 227 | White | ENIG (Immersion Gold) | 10 | View detail |
| ALU-20260316-040 | Aluminum PCB | 2 | 121 x 176.5 | White | OSP | 20 | View detail |
