Copper Core PCB Production Record #CU-20260120-026

This production record covers ten copper core PCB panels with 380W/mK thermal conductivity. Measuring 118 x 138 mm and 1.5 mm thick, the single-layer boards featured 10/10 mil minimum trace and spacing along with 1.5 mm minimum hole size. We focused on copper core preparation and thermal via processing to support effective heat dissipation for the intended application.

Following circuit imaging and etching, heavy copper plating was applied as needed. Matte black solder mask was applied prior to the immersion gold ENIG surface finish, achieved through electroless nickel and immersion gold deposition. No silkscreen was required for this build. Full electrical testing verified continuity and isolation on all panels.

The complete manufacturing sequence, including material preparation through final inspection, spanned 13.1 days and yielded panels with consistent thermal and mechanical properties. Execution of the plating and via processes ensured the boards would perform reliably in high thermal load environments.