PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | Copper Core PCB | Quantity | 20 pcs |
| Layers | 1 Layers | Board Type | Panel PCB |
| Dimensions | 29 x 20 mm | Copper Weight | 1oz |
| Thickness | 1.5 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | OSP | Min Hole Size | 1.2mm |
| Solder Mask | Warm White | Silkscreen | Black |
| Thermal Conductivity | 380W |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
For this copper core PCB order, we fabricated 20 panels sized at 29 x 20 mm. The single-layer boards measured 1.5 mm thick with 1 oz copper and delivered a thermal conductivity of 380W. Featuring 6/6 mil minimum track and spacing along with 1.2 mm holes, the design incorporated warm white soldermask and black silkscreen for clear readability. OSP surface finish completed the stackup.
During manufacturing, copper core preparation received particular attention to maintain the material's thermal efficiency. Circuit imaging and etching created the required circuitry, while thermal via processing and heavy copper plating improved heat dissipation and via reliability. Solder mask was applied prior to the organic coating and anti-oxidation steps that establish the OSP finish.
The full production cycle spanned 9.5 days and concluded with thorough electrical testing. All panels met specifications, resulting in reliable boards optimized for thermal performance in their intended high-power environment.
Explore More PCB Manufacturing Resources
Copper Core PCB Manufacturing Insights
Copper core PCBs deliver high thermal conductivity for power applications. Manufacturing emphasizes reliable core bonding and precise via formation.
Stackup and Gold Thickness Limits in Thermoelectric Separation Copper Base PCBs
This technical assessment examines manufacturing capability for thermoelectric separation copper base PCBs. It focuses on the decision to adopt conventional stackup over customer documentation and the resulting 0.05µm ENIG gold thickness limit caused by direct connection between edge pads and base copper, while maintaining 380W thermal conductivity and insulation performance.
Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| CU-20261008-082 | Copper Core PCB | 1 | 110 x 84 | Warm White | OSP | 30 | View detail |
| CU-20260720-048 | Copper Core PCB | 1 | 100 x 84 | Warm White | OSP | 10 | View detail |
| CU-20260719-033 | Copper Core PCB | 1 | 123.2 x 83.8 | Matte Black | OSP | 5 | View detail |
