PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | Copper Core PCB | Quantity | 10 pcs |
| Layers | 1 Layers | Board Type | Panel PCB |
| Dimensions | 100 x 84 mm | Copper Weight | 2oz |
| Thickness | 1.5 mm | Min Track / Spacing | 5/5mil |
| Surface Finish | OSP | Min Hole Size | 1.2mm |
| Solder Mask | Warm White | Silkscreen | Black |
| Thermal Conductivity | 380W |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
This production record covers a set of 10 single-layer copper core PCBs configured as panels. Each board measures 100 × 84 mm with 1.5 mm thickness, 2 oz copper weight, and a high thermal conductivity rating of 380 W/mK. Manufacturing included dedicated copper core preparation and thermal via processing to support effective heat transfer, along with 5/5 mil minimum trace and spacing that required controlled copper etching for accuracy on this heavier copper substrate.
We performed thick copper electroplating and heavy copper plating steps prior to circuit definition. Application of warm white solder mask and black silkscreen was followed by OSP surface finish via organic coating and anti-oxidation treatment. The 1.2 mm minimum hole size was maintained throughout plating and drilling sequences for this copper core PCB.
Completed over 12 days, the order underwent comprehensive electrical testing, resulting in panels that deliver reliable thermal management and electrical performance for their intended high-power use.
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Copper core PCBs deliver high thermal conductivity for power applications. Manufacturing emphasizes reliable core bonding and precise via formation.
Stackup and Gold Thickness Limits in Thermoelectric Separation Copper Base PCBs
This technical assessment examines manufacturing capability for thermoelectric separation copper base PCBs. It focuses on the decision to adopt conventional stackup over customer documentation and the resulting 0.05µm ENIG gold thickness limit caused by direct connection between edge pads and base copper, while maintaining 380W thermal conductivity and insulation performance.
Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| CU-20261008-082 | Copper Core PCB | 1 | 110 x 84 | Warm White | OSP | 30 | View detail |
| CU-20260923-045 | Copper Core PCB | 1 | 29 x 20 | Warm White | OSP | 20 | View detail |
| CU-20260719-033 | Copper Core PCB | 1 | 123.2 x 83.8 | Matte Black | OSP | 5 | View detail |
