PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | Copper Core PCB | Quantity | 30 pcs |
| Layers | 1 Layers | Board Type | Panel PCB |
| Dimensions | 110 x 84 mm | Copper Weight | 1oz |
| Thickness | 1.5 mm | Min Track / Spacing | 5/5mil |
| Surface Finish | OSP | Min Hole Size | 1.2mm |
| Solder Mask | Warm White | Silkscreen | Black |
| Thermal Conductivity | 380W |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
For this order of 30 copper core panel PCBs, we processed single-layer boards with 380W/mK thermal conductivity, dimensions of 110 x 84 mm, and a thickness of 1.5 mm. The 5/5 mil minimum track and spacing represented a tighter geometry for this material, complemented by 1.2 mm holes, warm white soldermask, black silkscreen, and OSP surface finish. These choices required specialized handling during imaging, etching, and coating to maintain the core's thermal properties.
We performed copper core preparation and thermal via processing early in the flow, followed by circuit imaging and etching, heavy copper plating, solder mask application, and organic coating. Anti-oxidation treatment and detailed electrical testing concluded the manufacturing steps. Over the 14.1-day production period, each phase was executed to ensure the panels retained flatness and conductivity essential for high-performance use.
All 30 panels met the specification criteria with consistent results, providing dependable thermal management capability as intended for this copper core PCB design.
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Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| CU-20260923-045 | Copper Core PCB | 1 | 29 x 20 | Warm White | OSP | 20 | View detail |
| CU-20260720-048 | Copper Core PCB | 1 | 100 x 84 | Warm White | OSP | 10 | View detail |
| CU-20260719-033 | Copper Core PCB | 1 | 123.2 x 83.8 | Matte Black | OSP | 5 | View detail |
