Coupons
Help
  • FAQ
    browse most common questions
  • Live Chat
    talk with our online service
  • Email
    contact your dedicated sales:

6 Layer Flexible PCB Production Record #FPC-20230115-0119

Start Flexible PCB Quote

PCB Specifications

Parameter Value Parameter Value
PCB Type Flexible PCB Quantity 10 pcs
Layers 6 Layers Board Type Single PCB
Dimensions 174 x 174 mm Copper Weight 1/2OZ
Thickness 0.23 mm Min Track / Spacing 4/4mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.15mm
Solder Mask Yellow Silkscreen White
Material Rolled Copper Stiffener FR4 Stiffener

Manufacturing Timeline

Order Created
Sep 27 16:50
Files Ready
Sep 27 16:50
Engineering Review Completed
Sep 27 16:58
Payment down
Sep 27 16:58
Production Started
Sep 27 16:59
Production Completed
Oct 26 13:57
Progress: 0/6
Engineering Review time: 8 min
Production time: 28.9d

Logistics Information

Production Completed→Shipping : 81.1d
Carrier
UPS
Destination
UNITED STATES OF AMERICA
Shipping Method
Express Air
Shipping Time
Jan 15 14:50

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Polyimide Material Handling
04
Inner Layer Imaging
05
Circuit Imaging & Etching
06
Layer Stack Alignment
07
High Pressure Lamination
08
Coverlay Lamination
09
Solder Mask Application
10
Electroless Nickel Deposition
11
Immersion Gold Deposition
12
Dynamic Flex Testing
13
Electrical Testing

Manufacturing Summary

For this order of ten 6-layer flexible PCBs, production centered on a thin 0.23 mm construction utilizing 1/2 oz rolled copper and polyimide base material. The 174 x 174 mm single boards presented a minimum track and spacing of 4/4 mil together with 0.15 mm holes, demanding careful imaging and etching. Yellow solder mask, white silkscreen, immersion gold ENIG surface finish, and FR4 stiffeners were integrated to match the specified requirements.

 

Execution involved detailed polyimide material handling and precise layer stack alignment ahead of high pressure lamination. Coverlay lamination preceded solder mask application, followed by the full ENIG process consisting of electroless nickel deposition and immersion gold. These steps ensured the thin flex layers maintained integrity throughout manufacturing.

 

Dynamic flex testing formed a key part of the verification, supplemented by comprehensive electrical testing. The resulting boards exhibited consistent quality and performance, delivering reliable flexible circuits suited to the customer's application needs.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FPC-20260707-032 Flexible PCB 4 157.2 x 38.6 Yellow ENIG (Immersion Gold) 125 View detail
FPC-20260526-023 Flexible PCB 4 50 x 75 Black ENIG (Immersion Gold) 5 View detail
FPC-20260516-042 Flexible PCB 3 76.2 x 457.2 Yellow ENIG (Immersion Gold) 5 View detail

2026 AIVON.COM All Rights Reserved
Intellectual Property Rights | Terms of Service | Privacy Policy | Refund Policy