Single Layer Flexible PCB Production Record #FPC-20260207-084

This order required production of 50 single-layer FPCs using 0.13 mm thick polyimide with rolled copper foil. The boards measure 6.5 × 500 mm, creating a long, narrow profile that needed careful fixturing during processing. With 6/6 mil trace spacing, 0.3 mm minimum holes, PI stiffeners, yellow soldermask, white silkscreen, and immersion gold ENIG finish, the job combined standard geometry with thin-film material handling and precise coverlay alignment.

Polyimide material handling and circuit imaging were executed first, followed by coverlay lamination and solder mask application tailored to the yellow formulation. Electroless nickel and immersion gold deposition produced a uniform surface suitable for reliable contact. The elongated shape demanded controlled tension throughout etching and plating to maintain dimensional accuracy across the full 500 mm length.

Dynamic flex testing verified endurance under repeated bending, while electrical testing confirmed continuity on every board. All 50 pieces were delivered within 6.1 days, meeting the specified mechanical and electrical requirements without deviation.