Single Layer Flexible PCB Production Record #FPC-20260306-094

This order consisted of 100 single-sided flexible PCBs, each measuring 73 x 34 mm and built to a total thickness of 0.1 mm using polyimide material with rolled copper at 1/2 oz. The configuration included 6/6 mil line width and spacing, minimum hole size of 0.3 mm, yellow soldermask, white legend, PI stiffener reinforcement, and an immersion gold ENIG surface finish. These specifications required precise handling of the thin flexible substrate to achieve the necessary bend characteristics while integrating localized stiffening.

Key processes started with engineering review and material preparation, followed by polyimide material handling, circuit imaging and etching, coverlay lamination, and solder mask application. Electroless nickel deposition and immersion gold deposition created a reliable ENIG finish. Dynamic flex testing was performed to confirm endurance under repeated motion, in addition to comprehensive electrical testing.

The nine-day production timeline allowed for thorough execution at each stage, resulting in consistent board quality that meets the mechanical and electrical demands of flexible applications. The combination of thin construction, specific color requirements, and stiffener placement was successfully realized across the full quantity.