Single Layer Flexible PCB Production Record #FPC-20260324-056

This order involved manufacturing 90 single-layer Flexible PCBs in panel configuration. The boards measure 32 x 45 mm with an overall thickness of 0.1 mm, built on polyimide material with 1/2 oz rolled copper. Standard 6/6 mil track and spacing were maintained together with 0.3 mm minimum holes, white soldermask, black silkscreen, and no stiffener. These thin, panelized flexible circuits required precise material preparation to protect the substrate during processing.

Production progressed through circuit imaging and etching, coverlay lamination, and solder mask application. We then performed electroless nickel deposition followed by immersion gold deposition to deliver a uniform immersion gold ENIG finish. Process parameters were adjusted specifically for the rolled copper and thin polyimide to avoid wrinkling or delamination while ensuring good plating adhesion on the flexible base.

Dynamic flex testing and electrical testing verified mechanical durability and circuit integrity across the full batch. The complete manufacturing cycle was executed in 7.5 days, resulting in panels that consistently met the specified requirements for flexibility and electrical performance.