Single Layer Flexible PCB Production Record #FPC-20260620-002

This production run delivered five single-layer flexible boards in panel format, each panel measuring 201 × 472 mm with a total thickness of 0.13 mm. The circuit used ½ oz rolled copper on polyimide, standard 6/6 mil trace and spacing, and 0.3 mm minimum holes. White solder mask and black silkscreen were applied over the flex PCB coverlay, while immersion gold ENIG provided a reliable contact surface without stiffeners. The thin construction and rolled copper required careful handling throughout to preserve flexibility and flatness.

After engineering review and polyimide material preparation, the team performed circuit imaging and etching, followed by coverlay lamination and solder mask application. Electroless nickel deposition and immersion gold deposition completed the surface finish. Process parameters were adjusted for the lightweight copper and thin base to avoid distortion during thermal cycles.

Dynamic flex testing and full electrical testing verified bend endurance and circuit integrity before shipment. The order was completed in 5.9 days, resulting in consistent panel quality that matched the customer's flexible application requirements.