PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | Flexible PCB | Quantity | 500 pcs |
| Layers | 2 Layers | Board Type | Single PCB |
| Dimensions | 117.5 x 17.1 mm | Copper Weight | 1/2OZ |
| Thickness | 0.13 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | Hard gold plating | Min Hole Size | 0.2mm |
| Solder Mask | Yellow | Silkscreen | White |
| Material | Rolled Copper | Stiffener | PI Stiffener |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
These 500 units of 2-layer flex PCBs were manufactured using rolled copper on a polyimide base, achieving a total thickness of 0.13 mm. The long and narrow boards measured 117.5 x 17.1 mm and incorporated 1/2 oz copper with standard 6/6 mil track and spacing. Additional features included 0.2 mm minimum holes, yellow soldermask, white silkscreen, PI stiffeners for reinforcement in select areas, and hard gold plating for reliable contact performance on this thin flexible construction.
Key processes centered on careful polyimide material handling to preserve the thin substrate, followed by circuit imaging, etching, coverlay lamination, and application of the yellow solder mask. Dynamic flex testing formed a critical part of validation to confirm circuit endurance under bending stress.
Over the 13-day production schedule, AOI inspection and final electrical testing were executed to confirm uniformity and adherence to specifications across the full batch of flexible PCBs.
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Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FPC-20260803-025 | Flexible PCB | 2 | 292.5 x 8.5 | Yellow | ENIG (Immersion Gold) | 1000 | View detail |
| FPC-20260711-063 | Flexible PCB | 2 | 466.4 x 8.5 | White | ENIG (Immersion Gold) | 1440 | View detail |
| FPC-20260711-064 | Flexible PCB | 2 | 318.2 x 8.5 | White | ENIG (Immersion Gold) | 4500 | View detail |