2 Layer FR4 PCB Production Record #FR4-20240108-0118

This order comprised 15 panels of 2-layer FR4 PCB, each measuring 185.5 × 160 mm with 1.6 mm thickness and 1 oz copper. The design followed standard 6/6 mil track and spacing along with 0.3 mm minimum hole size, paired with blue solder mask and white silkscreen. OSP surface finish was applied to maintain flat pad surfaces and reliable solderability without metallic coatings, while the custom stackup required careful material selection during preparation to match the panel format exactly.

Production followed a structured sequence of engineering review, material preparation, circuit imaging and etching, followed by solder mask application. Organic coating application and anti-oxidation treatment established the OSP layer, after which every panel received full electrical testing to verify net continuity and isolation. The three-day schedule was met through coordinated processing of the moderate quantity, keeping all boards within specified tolerances for this conventional geometry.

The resulting panels exhibited uniform finish quality and dimensional stability, ready for direct assembly. Execution focused on delivering consistent electrical performance and surface integrity according to the provided specifications.