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1 Layer FR4 PCB Production Record #FR4-20240111-0029

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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 200 pcs
Layers 1 Layers Board Type Panel PCB
Dimensions 171 x 86 mm Copper Weight 1oz
Thickness 0.6 mm Min Track / Spacing 6/6mil↑
Surface Finish OSP Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen None
Stack-up Custom Impedance Control No

Manufacturing Timeline

Order Created
Jan 03 16:41
Files Ready
Jan 03 16:41
Engineering Review Completed
Jan 03 16:57
Payment down
Jan 03 23:18
Production Started
Jan 03 23:18
Production Completed
Jan 10 22:31
Progress: 0/6
Engineering Review time: 0.3 h
Production time: 7.0d

Logistics Information

Production Completed→Shipping : 5.3 h
Carrier
FedEx IP
Destination
GERMANY
Shipping Method
Express Air
Shipping Time
Jan 11 03:46

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Circuit Imaging & Etching
04
Solder Mask Application
05
Organic Coating Application
06
Anti-Oxidation Treatment
07
Electrical Testing

Manufacturing Summary

This production run of 200 single-layer FR4 panel PCBs measured 171 × 86 mm per panel with a finished thickness of 0.6 mm and 1 oz copper foil. The 6/6 mil minimum trace and spacing along with 0.3 mm hole size represented standard geometry, yet the thin substrate required controlled handling during material preparation and etching to maintain dimensional stability and prevent warping. Green solder mask was applied to one side while silkscreen was omitted per the customer's specification, and OSP surface finish provided the necessary solderability protection without metallic plating.

 

After engineering review of the custom stackup, the sequence advanced through circuit imaging and etching, solder mask application, organic coating, and anti-oxidation treatment. Each panel received full electrical testing to confirm net continuity and isolation across the 7-day manufacturing cycle. The OSP process was calibrated to deliver uniform coating thickness, ensuring reliable assembly performance for these thin single-layer boards.

 

The completed panels exhibited consistent surface quality and flatness at the targeted thickness, meeting all specified tolerances without deviation. This execution delivered dependable FR4 OSP boards ready for standard downstream processes.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260709-057 FR4 PCB 2 378 x 258 White OSP 20 View detail
FR4-20260709-018 FR4 PCB 1 116.6 x 62.34 Green HASL Lead Free 5 View detail
FR4-20260625-033 FR4 PCB 1 51.4 x 51.4 Green OSP 600 View detail

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