PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 5 pcs |
| Layers | 4 Layers | Board Type | Panel PCB |
| Dimensions | 118.87 x 184.51 mm | Copper Weight | 1oz |
| Thickness | 1.2 mm | Min Track / Spacing | 4/4mil |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.25mm |
| Solder Mask | Green | Silkscreen | None |
| Stack-up | Default | Impedance Control | No |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
This production run consisted of five 4-layer FR4 panels measuring 118.87 × 184.51 mm at 1.2 mm thickness with 1 oz copper. The 4/4 mil minimum track and spacing defined tighter geometry that guided our inner layer imaging, circuit etching, and stack alignment steps. Material preparation and high-pressure lamination secured accurate registration across the default stackup while the panel format supported efficient handling despite the modest order quantity.
Green solder mask was applied prior to surface finishing. Electroless nickel deposition followed by immersion gold created a uniform ENIG finish suited to the 0.25 mm minimum holes. Without silkscreen or impedance control requirements, process flow remained streamlined from lamination through to final electrical testing, confirming continuity and isolation on every net.
The complete order was delivered in 4.1 days, yielding consistent multilayer boards that matched all specified parameters. Execution focused on precise control of the tighter features and reliable layer bonding to support straightforward downstream assembly.
Explore More PCB Manufacturing Resources
4 Layer FR4 PCB Manufacturing Insights
Standard multilayer solution offering practical routing density and controlled impedance for industrial and consumer electronics.
Multilayer FR4 PCB Engineering Queries Explained: Causes, Risks and Solutions
In-depth guide to the most frequent Engineering Queries (EQ) and DFM issues in Multilayer FR4 PCB (4/6/8+ layers) production. Real factory insights on stack-up confirmation, impedance control, copper balance, inner layer design, via treatment, registration, and practical prevention strategies.
Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260630-014 | FR4 PCB | 2 | 126 x 145 | Green | ENIG (Immersion Gold) | 10 | View detail |
| FR4-20260605-042 | FR4 PCB | 4 | 65 x 100 | Green | HASL Lead Free | 5 | View detail |
| FR4-20260605-041 | FR4 PCB | 4 | 66.04 x 54.1 | Green | HASL Lead Free | 5 | View detail |
