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4 Layer FR4 PCB Production Record #FR4-20251211-012

FR4 PCB 4 Layers ENIG (Immersion Gold) 4/4mil Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 5 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 90 x 150 mm Copper Weight 1oz
Thickness 1.6 mm Min Track / Spacing 4/4mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.2mm
Solder Mask Matte Green Silkscreen White
Stack-up Custom Impedance Control No

Manufacturing Timeline

Order Created
Dec 03 15:47
Files Ready
Dec 03 15:47
Engineering Review Completed
Payment down
Dec 04 16:19
Production Started
Dec 04 16:24
Production Completed
Dec 08 02:39
Progress: 0/6
Production time: 3.5d

Logistics Information

Production Completed→Shipping : 3.5d
Carrier
DHL
Destination
BELGIUM
Shipping Method
Express Air
Shipping Time
Dec 11 14:22

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Solder Mask Application
08
Electroless Nickel Deposition
09
Immersion Gold Deposition
10
Electrical Testing

Manufacturing Summary

For this production run, five 4-layer FR4 panel PCBs were manufactured to dimensions of 90 x 150 mm. The boards employed a custom stackup at 1.6 mm thickness with 1 oz copper throughout, 4/4 mil minimum trace and spacing, and 0.2 mm minimum hole size. Matte green soldermask, white silkscreen, and immersion gold ENIG surface finish were selected to satisfy both functional and visual requirements without impedance control.

 

Manufacturing followed a controlled sequence of engineering review, material preparation, inner layer imaging, and circuit etching to maintain registration on the tighter geometries. Layer stack alignment, high-pressure lamination, solder mask application, electroless nickel deposition, and immersion gold deposition were executed in succession. Electrical testing at the conclusion verified continuity and isolation across all five panels.

 

Completed in 3.5 days, the order yielded consistent panel quality with accurate feature definition and reliable layer bonding. The execution balanced the custom stackup and finer 4 mil geometries with standard thickness, delivering panels ready for immediate downstream assembly.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260630-014 FR4 PCB 2 126 x 145 Green ENIG (Immersion Gold) 10 View detail
FR4-20260609-017 FR4 PCB 4 103.68 x 69.19 Green HASL Lead Free 10 View detail
FR4-20260605-042 FR4 PCB 4 65 x 100 Green HASL Lead Free 5 View detail

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