4 Layer FR4 PCB Production Record #FR4-20251211-012

For this production run, five 4-layer FR4 panel PCBs were manufactured to dimensions of 90 x 150 mm. The boards employed a custom stackup at 1.6 mm thickness with 1 oz copper throughout, 4/4 mil minimum trace and spacing, and 0.2 mm minimum hole size. Matte green soldermask, white silkscreen, and immersion gold ENIG surface finish were selected to satisfy both functional and visual requirements without impedance control.

Manufacturing followed a controlled sequence of engineering review, material preparation, inner layer imaging, and circuit etching to maintain registration on the tighter geometries. Layer stack alignment, high-pressure lamination, solder mask application, electroless nickel deposition, and immersion gold deposition were executed in succession. Electrical testing at the conclusion verified continuity and isolation across all five panels.

Completed in 3.5 days, the order yielded consistent panel quality with accurate feature definition and reliable layer bonding. The execution balanced the custom stackup and finer 4 mil geometries with standard thickness, delivering panels ready for immediate downstream assembly.