PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 200 pcs |
| Layers | 4 Layers | Board Type | Panel PCB |
| Dimensions | 313 x 161 mm | Copper Weight | 1oz |
| Thickness | 1.6 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.3mm↑ |
| Solder Mask | Green | Silkscreen | White |
| Stack-up | Default | Impedance Control | No |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
For this order of 200 standard 4-layer FR4 PCB panels measuring 313 × 161 mm and 1.6 mm thick, production followed a disciplined sequence of inner layer imaging, circuit etching, and high-pressure lamination using the default stackup. All layers employed 1 oz copper with 6/6 mil minimum track and spacing together with 0.3 mm minimum hole size. The panel format required careful registration during alignment to maintain dimensional stability across the relatively large boards.
Green solder mask and white silkscreen were applied after lamination, followed by electroless nickel deposition and immersion gold deposition to create a uniform ENIG finish. This surface treatment was selected to ensure consistent solderability without the thermal stress associated with HASL. Electrical testing verified continuity and isolation on every panel before release.
The complete manufacturing cycle was executed in 7.5 days, delivering panels that met all specified tolerances and quality requirements for downstream assembly.
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Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260717-013 | FR4 PCB | 4 | 43.81 x 86.99 | Black | HASL Lead Free | 10 | View detail |
| FR4-20260708-062 | FR4 PCB | 4 | 462.57 x 205 | Matte Black | ENIG (Immersion Gold) | 5 | View detail |
| FR4-20260630-014 | FR4 PCB | 2 | 126 x 145 | Green | ENIG (Immersion Gold) | 10 | View detail |
