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4 Layer FR4 PCB Production Record #FR4-20251219-021

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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 75 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 188 x 325 mm Copper Weight 1oz
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen None
Stack-up Custom Impedance Control Yes

Manufacturing Timeline

Order Created
Dec 04 21:05
Files Ready
Dec 04 21:05
Engineering Review Completed
Dec 04 21:05
Payment down
Dec 05 15:42
Production Started
Dec 05 15:45
Production Completed
Dec 16 17:17
Progress: 0/6
Production time: 11.1d

Logistics Information

Production Completed→Shipping : 2.9d
Carrier
UPS
Destination
CZECH REPUBLIC, THE
Shipping Method
Express Air
Shipping Time
Dec 19 14:16

Key Manufacturing Processes

01
Engineering Review
02
Stackup Impedance Engineering
03
Trace Width Compensation
04
Material Preparation
05
Inner Layer Imaging
06
Circuit Imaging & Etching
07
Layer Stack Alignment
08
High Pressure Lamination
09
Solder Mask Application
10
Electroless Nickel Deposition
11
Immersion Gold Deposition
12
TDR Impedance Testing
13
Electrical Testing

Manufacturing Summary

This production record covers 75 panels of a standard 4-layer FR4 PCB, each sized 188 x 325 mm with 1.6 mm thickness and 1 oz copper weight. Configured with a custom stackup to support impedance control, the boards utilized conventional 6/6 mil geometry along with 0.3 mm minimum hole sizes. Green solder mask was applied without silkscreen per the order requirements, complemented by an immersion gold ENIG surface finish for optimal conductivity and protection.

 

Manufacturing began with engineering review and stackup impedance engineering, including trace width compensation to achieve the target impedance values. Inner layer imaging, precise circuit etching, and high-pressure lamination established solid interlayer alignment. Subsequent processes involved solder mask application, electroless nickel deposition, and immersion gold deposition, followed by comprehensive TDR impedance testing and electrical testing to confirm compliance.

 

The 11-day production cycle yielded consistent results across all 75 panels, delivering dependable impedance controlled PCBs that meet the exacting standards for signal integrity and assembly reliability.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260717-013 FR4 PCB 4 43.81 x 86.99 Black HASL Lead Free 10 View detail
FR4-20260708-062 FR4 PCB 4 462.57 x 205 Matte Black ENIG (Immersion Gold) 5 View detail
FR4-20260630-014 FR4 PCB 2 126 x 145 Green ENIG (Immersion Gold) 10 View detail

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