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4 Layer FR4 PCB Production Record #FR4-20260105-006

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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 300 pcs
Layers 4 Layers Board Type Single PCB
Dimensions 418 x 38 mm Copper Weight 1oz
Thickness 0.8 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen White
Stack-up Default Impedance Control No

Manufacturing Timeline

Order Created
Dec 05 10:54
Files Ready
Dec 05 10:54
Engineering Review Completed
Dec 06 09:55
Payment down
Dec 05 19:49
Production Started
Dec 06 09:55
Production Completed
Dec 16 07:31
Progress: 0/6
Engineering Review time: 1.0d
Production time: 10.0d With Engineering Questions

Logistics Information

Production Completed→Shipping : 20.5d
Carrier
无需发货
Destination
KOREA, REPUBLIC OF (SOUTH K.)
Shipping Method
Express Air
Shipping Time
Jan 05 17:39

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Solder Mask Application
08
Electroless Nickel Deposition
09
Immersion Gold Deposition
10
Panelization Optimization
11
Batch AOI Inspection
12
Yield Control Management
13
Electrical Testing

Manufacturing Summary

This 4-layer FR-4 board measured 418 × 38 mm with a thin 0.8 mm thickness, TG130 material, and 1 oz copper on both sides. Produced as 300 single pieces, the order used ENIG surface finish (1 µin gold, approximately 20 % area), green solder mask, and white silkscreen. Minimum holes were 0.3 mm with standard 6 mil line/space and exceptionally high hole density. The 5-day schedule included 100% flying probe testing on the long, narrow format.

 

DFM review addressed several design and process constraints. Non-functional independent pads on the inner layers were removed to simplify fabrication. Silkscreen characters fell below reliable printability (standard minimum 0.75 mm height / 0.65 mm width) and risked blurry results. All instructional notes embedded inside the image files were disregarded. Certain solder-mask openings located in the center of pads prevented formation of bridges. IC pad spacings below 0.18 mm similarly made solder mask bridges impossible, requiring full window openings. Production files were prepared according to these decisions and required careful customer confirmation before release.

 

Confirmed pad deletion, silkscreen limitations, and mask-window strategy were implemented prior to production. The thin boards achieved consistent ENIG plating and mechanical integrity within the planned timeline. Full electrical test reports and quality certificates accompanied the shipment, confirming the panels met the specified dimensional and electrical requirements.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260717-013 FR4 PCB 4 43.81 x 86.99 Black HASL Lead Free 10 View detail
FR4-20260708-062 FR4 PCB 4 462.57 x 205 Matte Black ENIG (Immersion Gold) 5 View detail
FR4-20260630-014 FR4 PCB 2 126 x 145 Green ENIG (Immersion Gold) 10 View detail

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