| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 300 pcs |
| Layers | 4 Layers | Board Type | Single PCB |
| Dimensions | 418 x 38 mm | Copper Weight | 1oz |
| Thickness | 0.8 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.3mm↑ |
| Solder Mask | Green | Silkscreen | White |
| Stack-up | Default | Impedance Control | No |
This 4-layer FR-4 board measured 418 × 38 mm with a thin 0.8 mm thickness, TG130 material, and 1 oz copper on both sides. Produced as 300 single pieces, the order used ENIG surface finish (1 µin gold, approximately 20 % area), green solder mask, and white silkscreen. Minimum holes were 0.3 mm with standard 6 mil line/space and exceptionally high hole density. The 5-day schedule included 100% flying probe testing on the long, narrow format.
DFM review addressed several design and process constraints. Non-functional independent pads on the inner layers were removed to simplify fabrication. Silkscreen characters fell below reliable printability (standard minimum 0.75 mm height / 0.65 mm width) and risked blurry results. All instructional notes embedded inside the image files were disregarded. Certain solder-mask openings located in the center of pads prevented formation of bridges. IC pad spacings below 0.18 mm similarly made solder mask bridges impossible, requiring full window openings. Production files were prepared according to these decisions and required careful customer confirmation before release.
Confirmed pad deletion, silkscreen limitations, and mask-window strategy were implemented prior to production. The thin boards achieved consistent ENIG plating and mechanical integrity within the planned timeline. Full electrical test reports and quality certificates accompanied the shipment, confirming the panels met the specified dimensional and electrical requirements.
Discover how AIVON manufactures 4 Layer FR4 PCBs, including multilayer stackup design, layer alignment control, fabrication processes, manufacturing challenges, and real production experience from customer orders.
Real multilayer FR4 PCB CAM review cases covering stack-up confirmation, impedance control, copper balance, via tenting, and edge clearance EQs. Discover practical DFM best practices for 4-layer and higher boards to reduce engineering queries, prevent warpage, and improve first-pass yield.
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260717-013 | FR4 PCB | 4 | 43.81 x 86.99 | Black | HASL Lead Free | 10 | View detail |
| FR4-20260708-062 | FR4 PCB | 4 | 462.57 x 205 | Matte Black | ENIG (Immersion Gold) | 5 | View detail |
| FR4-20260630-014 | FR4 PCB | 2 | 126 x 145 | Green | ENIG (Immersion Gold) | 10 | View detail |