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4 Layer FR4 PCB Production Record #FR4-20260105-008

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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 300 pcs
Layers 4 Layers Board Type Single PCB
Dimensions 418 x 38 mm Copper Weight 1oz
Thickness 0.8 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen White
Stack-up Default Impedance Control No

Manufacturing Timeline

Order Created
Dec 05 10:58
Files Ready
Dec 05 10:58
Engineering Review Completed
Dec 06 09:55
Payment down
Dec 05 19:49
Production Started
Dec 06 09:55
Production Completed
Dec 16 07:32
Progress: 0/6
Engineering Review time: 1.0d
Production time: 10.0d With Engineering Questions

Logistics Information

Production Completed→Shipping : 20.5d
Carrier
无需发货
Destination
KOREA, REPUBLIC OF (SOUTH K.)
Shipping Method
Express Air
Shipping Time
Jan 05 17:39

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Solder Mask Application
08
Electroless Nickel Deposition
09
Immersion Gold Deposition
10
Panelization Optimization
11
Batch AOI Inspection
12
Yield Control Management
13
Electrical Testing

Manufacturing Summary

This production record covers 300 units of standard 4-layer FR4 PCB, each measuring 418 × 38 mm and finished at 0.8 mm thickness. The long, narrow aspect ratio combined with the thinner-than-standard board required precise inner layer imaging, controlled high-pressure lamination, and careful layer stack alignment to maintain registration across the extended panel. Material preparation and engineering review focused on minimizing warp while preserving the default stackup with 1 oz copper layers.

 

We applied 6/6 mil minimum track spacing and 0.3 mm holes using conventional processes, then completed solder mask application, electroless nickel deposition, and immersion gold deposition to produce a uniform ENIG surface finish. Green soldermask with white silkscreen was followed by batch AOI inspection, electrical testing, and yield control. The full cycle from circuit imaging through final delivery was executed in 10 days, delivering consistent boards suited for reliable assembly.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260717-013 FR4 PCB 4 43.81 x 86.99 Black HASL Lead Free 10 View detail
FR4-20260708-062 FR4 PCB 4 462.57 x 205 Matte Black ENIG (Immersion Gold) 5 View detail
FR4-20260630-014 FR4 PCB 2 126 x 145 Green ENIG (Immersion Gold) 10 View detail

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