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4 Layer FR4 PCB Production Record #FR4-20260105-042

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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 5 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 233 x 179 mm Copper Weight 1oz
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.2mm
Solder Mask Green Silkscreen White
Stack-up Default Impedance Control No

Manufacturing Timeline

Order Created
Dec 28 17:56
Files Ready
Dec 28 17:56
Engineering Review Completed
Dec 31 17:59
Payment down
Dec 18 20:09
Production Started
Dec 31 18:00
Production Completed
Jan 05 02:15
Progress: 0/6
Engineering Review time: 3.1d
Production time: 4.4d With Engineering Questions

Logistics Information

Production Completed→Shipping : 0.6d
Carrier
DHL
Destination
POLAND
Shipping Method
Express Air
Shipping Time
Jan 05 16:09

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Solder Mask Application
08
Electroless Nickel Deposition
09
Immersion Gold Deposition
10
Electrical Testing

Manufacturing Summary

This 4-layer FR-4 board measured 233 × 179 mm with 1.6 mm thickness, TG130 material, and asymmetric copper of 0.5 oz inner / 1 oz outer. Produced as 20 pieces in 2×2 panels for 5 sets, the order used ENIG surface finish with 2 µin gold thickness, green solder mask, and white silkscreen. Minimum holes were 0.2 mm with standard 6 mil line/space. Aluminum plugged vias were specified, and 8 mm process edges supported V-cut separation. The 3-day schedule included 100% flying probe testing.

 

DFM review focused on solder-mask and paste alignment. Stencil openings were larger than the corresponding solder-mask windows while copper pads existed underneath; the paste geometry was therefore transferred to the solder mask layer for consistency. Certain openings would have allowed solder deposition directly onto traces; these were adjusted by retracting the solder-mask windows to cover the traces and prevent unwanted wetting. The production files were prepared according to these recommendations, with confirmation requested that no further changes were needed to avoid delivery impact.

 

Confirmed solder-mask window adjustments and aluminum via plugging were implemented prior to production. The boards achieved consistent ENIG plating and reliable via filling within the accelerated timeline. Full electrical test reports and quality certificates accompanied the shipment, confirming the panels met the specified mechanical and electrical requirements.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260717-013 FR4 PCB 4 43.81 x 86.99 Black HASL Lead Free 10 View detail
FR4-20260708-062 FR4 PCB 4 462.57 x 205 Matte Black ENIG (Immersion Gold) 5 View detail
FR4-20260630-014 FR4 PCB 2 126 x 145 Green ENIG (Immersion Gold) 10 View detail

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