4 Layer FR4 PCB Production Record #FR4-20260121-009
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 5 pcs |
| Layers | 4 Layers | Board Type | Panel PCB |
| Dimensions | 223.99 x 163.8 mm | Copper Weight | 1oz |
| Thickness | 1.6 mm | Min Track / Spacing | 5/5mil |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.1mm |
| Solder Mask | Green | Silkscreen | None |
| Stack-up | Default | Impedance Control | No |
This 4-layer FR-4 TG170 PCB consisted of five boards sized 223.99 × 163.8 mm with 1.6 mm finished thickness and 1 oz copper on both outer layers. Production used standard FR-4 material (S1000-2M), ENIG surface finish, and included blind vias. The design featured a minimum hole size of 0.1 mm and 5 mil line/space geometry, falling into tighter conventional specifications. All boards underwent 100% flying probe testing and were delivered as a 1×5 panel configuration with final shipping dimensions of approximately 224 × 163.8 mm.
During CAM review, several DFM issues required resolution. Copper overhang was present on outline layers across all routing layers; to prevent burrs and edge quality problems during depanelization, we implemented single-side 0.2 mm milling, ensuring clean board edges without rolled copper. Top-layer legend characters were undersized, so we enlarged them following established sizing references to maintain legibility after solder mask application. Bottom-layer solder mask lines and characters were removed per customer request, with factory code added in place of the unavailable UL mark. Panelization followed the customer's 1×5 preference, and the lamination stack-up was adjusted to achieve 1.55 mm ±10% thickness.
These copper overhang and legend sizing adjustments were executed efficiently, resulting in full production confirmation and successful delivery within the 14-day lead time. The boards passed electrical testing with consistent impedance and plating quality, meeting all specified requirements for this small-volume run.
Standard multilayer solution offering practical routing density and controlled impedance for industrial and consumer electronics.
In-depth guide to the most frequent Engineering Queries (EQ) and DFM issues in Multilayer FR4 PCB (4/6/8+ layers) production. Real factory insights on stack-up confirmation, impedance control, copper balance, inner layer design, via treatment, registration, and practical prevention strategies.
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260717-013 | FR4 PCB | 4 | 43.81 x 86.99 | Black | HASL Lead Free | 10 | View detail |
| FR4-20260708-062 | FR4 PCB | 4 | 462.57 x 205 | Matte Black | ENIG (Immersion Gold) | 5 | View detail |
| FR4-20260630-014 | FR4 PCB | 2 | 126 x 145 | Green | ENIG (Immersion Gold) | 10 | View detail |
