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4 Layer FR4 PCB Production Record #FR4-20260306-083

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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 100 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 233 x 179 mm Copper Weight 1oz
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.2mm
Solder Mask Green Silkscreen White
Stack-up Custom Impedance Control No

Manufacturing Timeline

Order Created
Feb 22 09:54
Files Ready
Feb 22 10:06
Engineering Review Completed
Feb 26 23:33
Payment down
Feb 27 16:03
Production Started
Feb 27 16:05
Production Completed
Mar 05 05:00
Progress: 0/6
Engineering Review time: 4.6d Multiple File Revisions
Production time: 5.6d With Engineering Questions

Logistics Information

Production Completed→Shipping : 1.4d
Carrier
DHL
Destination
POLAND
Shipping Method
Express Air
Shipping Time
Mar 06 14:17

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Solder Mask Application
08
Electroless Nickel Deposition
09
Immersion Gold Deposition
10
Electrical Testing

Manufacturing Summary

 

This 4-layer FR-4 board measured 233 × 179 mm with 1.6 mm thickness, TG130 material, and asymmetric copper weights of 0.5 oz inner / 1 oz outer. Produced as 400 pieces in 2×2 panels for 100 sets, the order used ENIG surface finish (1 µin gold), green solder mask, and white silkscreen. Minimum holes were 0.2 mm with standard 6 mil line/space, high hole density of approximately 86 800 holes/m², and 8 mm process edges on all sides supporting V-cut separation. The 4-day schedule included 100% flying probe testing.

 

DFM review resolved multiple data-source conflicts. The supplied package contained numerous files; production was confirmed to follow the specific PCB file indicated by the arrow. Board outline was locked to the GM3 layer. A slot feature showed inconsistency between the drill layer and GM1 layer, requiring explicit selection of the governing data set. As a return order, the complete production process package from the prior job was adopted and the original files disregarded for fabrication purposes.

 

Confirmed file prioritization, outline reference, and slot definition were implemented prior to release. The boards achieved consistent ENIG plating and registration across the 4-layer stack within the accelerated timeline. Full electrical test reports and quality certificates accompanied the shipment, confirming the panels met the specified mechanical and electrical requirements.

 

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260717-013 FR4 PCB 4 43.81 x 86.99 Black HASL Lead Free 10 View detail
FR4-20260708-062 FR4 PCB 4 462.57 x 205 Matte Black ENIG (Immersion Gold) 5 View detail
FR4-20260630-014 FR4 PCB 2 126 x 145 Green ENIG (Immersion Gold) 10 View detail

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