Coupons
Help
  • FAQ
    browse most common questions
  • Live Chat
    talk with our online service
  • Email
    contact your dedicated sales:

6 Layer FR4 PCB Production Record #FR4-20260307-058

Start FR4 PCB Quote

PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 20 pcs
Layers 6 Layers Board Type Panel PCB
Dimensions 120 x 110.16 mm Copper Weight 1oz
Thickness 1.6 mm Min Track / Spacing 5/5mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.25mm
Solder Mask Green Silkscreen White
Stack-up Custom Impedance Control No

Manufacturing Timeline

Order Created
Jan 07 17:23
Files Ready
Jan 07 18:18
Engineering Review Completed
Jan 07 18:44
Payment down
Jan 12 20:26
Production Started
Jan 13 09:14
Production Completed
Jan 23 14:53
Progress: 0/6
Engineering Review time: 0.4 h
Production time: 10.3d With Engineering Questions

Logistics Information

Production Completed→Shipping : 43.2d
Carrier
UPS
Destination
UNITED STATES OF AMERICA
Shipping Method
Express Air
Shipping Time
Mar 07 17:47

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Solder Mask Application
08
Electroless Nickel Deposition
09
Immersion Gold Deposition
10
Electrical Testing

Manufacturing Summary

This 6-layer FR-4 board measured 120 × 110.16 mm with 1.6 mm thickness, TG170 material, and 1 oz copper on both sides. Produced as 20 pieces in 2×2 panels for 5 sets, the order used ENIG surface finish, green solder mask, and white silkscreen. The design featured tight 5 mil line/space geometry and 0.25 mm minimum holes. Customer notes required epoxy filling and capping of all 0.25 mm vias, with 4 mm process edges supporting routing separation. The 10-day schedule included 100% flying probe testing.

 

DFM review addressed several via and panel details. Although the order specified resin plugging only for 0.25 mm holes, process capability required vias plugging for consistent reliability; this was confirmed. Certain 0.5 mm holes carried openings in the original data and needed clarification of via status. Layer-3 features appeared partially connected and required explicit processing instructions. Tight pad spacings prevented formation of solder-mask bridges. Panel routing slots were reviewed to confirm whether stamp-hole bridge construction applied. Holes equal in size to their pads were designated NPTH, and dimensional inconsistencies between the drawing and Gerber data were resolved.

 

Confirmed via plugging scope, NPTH designation, and panel configuration were implemented prior to production. The boards achieved consistent ENIG plating and reliable resin plugging reliability handling across the 6-layer stack. Full electrical test reports and quality certificates accompanied the shipment, confirming the panels met the specified mechanical and electrical requirements.

 

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260708-062 FR4 PCB 4 462.57 x 205 Matte Black ENIG (Immersion Gold) 5 View detail
FR4-20260630-014 FR4 PCB 2 126 x 145 Green ENIG (Immersion Gold) 10 View detail
FR4-20260608-023 FR4 PCB 6 239 x 355 Black HASL Lead Free 25 View detail

2026 AIVON.COM All Rights Reserved
Intellectual Property Rights | Terms of Service | Privacy Policy | Refund Policy