4 Layer FR4 PCB Production Record #FR4-20260312-065
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 1000 pcs |
| Layers | 4 Layers | Board Type | Panel PCB |
| Dimensions | 160 x 129.5 mm | Copper Weight | 1oz |
| Thickness | 1.6 mm | Min Track / Spacing | 5/5mil |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.25mm |
| Solder Mask | Black | Silkscreen | White |
| Stack-up | Default | Impedance Control | Yes |
This 4-layer FR-4 board measured 160 × 129.5 mm with 1.6 mm thickness, TG130 material, and 1 oz copper on both sides. Produced as 1000 pieces in customer 1×1 panels, the order used ENIG surface finish, black solder mask, and white silkscreen. The design incorporated controlled impedance with a minimum line/space of 5 mil and 0.25 mm holes. V-cut separation was applied, and the 10-day schedule included engineering test fixtures together with 100 % flying-probe verification.
DFM coordination resolved several impedance and process constraints. Single-ended impedance traces originally specified at 5 mil were adjusted to 7 mil to meet manufacturable targets and confirmed. Black solder mask combined with component pin spacings below 0.25 mm prevented reliable solder mask bridges; full window openings were therefore applied. Missing tooling holes on the process edge required addition of 2.0 mm locating holes for stable forming. SMD pads positioned near the board outline risked exposed copper after routing and were reviewed for possible trimming. Certain component holes designed with tenting would allow ink intrusion, reducing finished diameter and impairing solderability; the treatment was clarified prior to release.
Confirmed impedance width changes, mask-window strategy, and tooling-hole additions were implemented before production. The boards achieved consistent ENIG plating and controlled-impedance performance across the full quantity. Full electrical test reports and quality certificates accompanied the shipment, confirming the panels met the specified mechanical and electrical requirements.
Discover how AIVON manufactures 4 Layer FR4 PCBs, including multilayer stackup design, layer alignment control, fabrication processes, manufacturing challenges, and real production experience from customer orders.
Real multilayer FR4 PCB CAM review cases covering stack-up confirmation, impedance control, copper balance, via tenting, and edge clearance EQs. Discover practical DFM best practices for 4-layer and higher boards to reduce engineering queries, prevent warpage, and improve first-pass yield.
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260717-013 | FR4 PCB | 4 | 43.81 x 86.99 | Black | HASL Lead Free | 10 | View detail |
| FR4-20260708-062 | FR4 PCB | 4 | 462.57 x 205 | Matte Black | ENIG (Immersion Gold) | 5 | View detail |
| FR4-20260630-014 | FR4 PCB | 2 | 126 x 145 | Green | ENIG (Immersion Gold) | 10 | View detail |
