| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 1020 pcs |
| Layers | 4 Layers | Board Type | Panel PCB |
| Dimensions | 55 x 70 mm | Copper Weight | 2oz |
| Thickness | 1.6 mm | Min Track / Spacing | 10/10mil |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.8mm↑ |
| Solder Mask | Green | Silkscreen | White |
| Stack-up | Custom | Impedance Control | No |
This FR-4 board used TG170 material at 1.6 mm thickness with 2 oz copper on both sides. The design incorporated ENIG surface finish (1.00 µm gold, approximately 30 % area), green solder mask, and white silkscreen. Panelization followed a 3×2 arrangement with tented vias, 0.8 mm minimum holes, and standard 10 mil line/space. Engineering test fixtures and IPC Class 3 acceptance criteria applied, with high hole density noted across the layout.
DFM coordination focused on documentation and marking consistency for this return order. Only a version number had been added relative to the prior revision; all other parameters matched the previous data and were confirmed. Production numbering placement was verified, and a year-week cycle mark was added in a blank silkscreen area to support batch traceability. The supplied production draft and PDF were reviewed solely for data confirmation (not stencil generation). Agreement was reached that any future mass-production runs of this part number would follow the process methods established on the approved sample.
Confirmed marking additions and version alignment were implemented prior to production. The heavy-copper boards achieved consistent ENIG plating and mechanical integrity under IPC Class 3 requirements. Full electrical test reports and quality certificates accompanied the shipment, confirming the panels met the specified dimensional and electrical criteria.
Discover how AIVON manufactures 4 Layer FR4 PCBs, including multilayer stackup design, layer alignment control, fabrication processes, manufacturing challenges, and real production experience from customer orders.
Real multilayer FR4 PCB CAM review cases covering stack-up confirmation, impedance control, copper balance, via tenting, and edge clearance EQs. Discover practical DFM best practices for 4-layer and higher boards to reduce engineering queries, prevent warpage, and improve first-pass yield.
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260717-013 | FR4 PCB | 4 | 43.81 x 86.99 | Black | HASL Lead Free | 10 | View detail |
| FR4-20260708-062 | FR4 PCB | 4 | 462.57 x 205 | Matte Black | ENIG (Immersion Gold) | 5 | View detail |
| FR4-20260630-014 | FR4 PCB | 2 | 126 x 145 | Green | ENIG (Immersion Gold) | 10 | View detail |