4 Layer FR4 PCB Production Record #FR4-20260317-040

This FR-4 board used TG170 material at 1.6 mm thickness with 2 oz copper on both sides. The design incorporated ENIG surface finish (1.00 µm gold, approximately 30 % area), green solder mask, and white silkscreen. Panelization followed a 3×2 arrangement with tented vias, 0.8 mm minimum holes, and standard 10 mil line/space. Engineering test fixtures and IPC Class 3 acceptance criteria applied, with high hole density noted across the layout.

DFM coordination focused on documentation and marking consistency for this return order. Only a version number had been added relative to the prior revision; all other parameters matched the previous data and were confirmed. Production numbering placement was verified, and a year-week cycle mark was added in a blank silkscreen area to support batch traceability. The supplied production draft and PDF were reviewed solely for data confirmation (not stencil generation). Agreement was reached that any future mass-production runs of this part number would follow the process methods established on the approved sample.

Confirmed marking additions and version alignment were implemented prior to production. The heavy-copper boards achieved consistent ENIG plating and mechanical integrity under IPC Class 3 requirements. Full electrical test reports and quality certificates accompanied the shipment, confirming the panels met the specified dimensional and electrical criteria.