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4 Layer FR4 PCB Production Record #FR4-20260317-040

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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 1020 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 55 x 70 mm Copper Weight 2oz
Thickness 1.6 mm Min Track / Spacing 10/10mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.8mm↑
Solder Mask Green Silkscreen White
Stack-up Custom Impedance Control No

Manufacturing Timeline

Order Created
Feb 24 15:21
Files Ready
Feb 24 15:21
Engineering Review Completed
Feb 24 17:21
Payment down
Feb 24 17:21
Production Started
Feb 24 17:21
Production Completed
Mar 17 17:36
Progress: 0/6
Engineering Review time: 2.0h
Production time: 21.1d With Engineering Questions

Logistics Information

Production Completed→Shipping : 0.3 h
Carrier
FedEx IP
Destination
THAILAND
Shipping Method
Express Air
Shipping Time
Mar 17 17:51

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Thick Copper Electroplating
08
Controlled Copper Etching
09
Solder Mask Application
10
Electroless Nickel Deposition
11
Immersion Gold Deposition
12
Panelization Optimization
13
Batch AOI Inspection
14
Yield Control Management
15
Electrical Testing

Manufacturing Summary

This FR-4 board used TG170 material at 1.6 mm thickness with 2 oz copper on both sides. The design incorporated ENIG surface finish (1.00 µm gold, approximately 30 % area), green solder mask, and white silkscreen. Panelization followed a 3×2 arrangement with tented vias, 0.8 mm minimum holes, and standard 10 mil line/space. Engineering test fixtures and IPC Class 3 acceptance criteria applied, with high hole density noted across the layout.

 

DFM coordination focused on documentation and marking consistency for this return order. Only a version number had been added relative to the prior revision; all other parameters matched the previous data and were confirmed. Production numbering placement was verified, and a year-week cycle mark was added in a blank silkscreen area to support batch traceability. The supplied production draft and PDF were reviewed solely for data confirmation (not stencil generation). Agreement was reached that any future mass-production runs of this part number would follow the process methods established on the approved sample.

 

Confirmed marking additions and version alignment were implemented prior to production. The heavy-copper boards achieved consistent ENIG plating and mechanical integrity under IPC Class 3 requirements. Full electrical test reports and quality certificates accompanied the shipment, confirming the panels met the specified dimensional and electrical criteria.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260717-013 FR4 PCB 4 43.81 x 86.99 Black HASL Lead Free 10 View detail
FR4-20260708-062 FR4 PCB 4 462.57 x 205 Matte Black ENIG (Immersion Gold) 5 View detail
FR4-20260630-014 FR4 PCB 2 126 x 145 Green ENIG (Immersion Gold) 10 View detail

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