6 Layer FR4 PCB Production Record #FR4-20260318-061

This 6-layer FR-4 board (62.7 × 62.7 mm square, 1.6 mm thick, TG170, 1 oz copper) was panelized 2×2 for a total of 20 pieces. Immersion gold surface finish was applied over 5 mil line/space geometry with matte green solder mask and white silkscreen. Aluminum plugged vias and 5 mm process edges on all sides supported mechanical forming, while 100% flying probe testing ensured electrical performance within a 4-day delivery schedule.

DFM clarification addressed hole attributes where non plated through holes definitions conflicted with pads on both layers, requiring final confirmation of plating intent. Square panel layout needed orientation verification to prevent rotation errors during assembly. English notes in customer images were ignored per standard process, and UL marking placement was aligned to available copper-free areas in the GBL layer. All points were resolved prior to production release.

Confirmed adjustments to via types and panel documentation allowed smooth execution of the multilayer stack with reliable aluminum plugging. The short-turn order was completed with consistent plating and registration, supported by full electrical test reports and quality certificates. Final boards met dimensional and functional specifications for customer use.